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Technology |
| Capabilities Overview |
| Rigid PCB: |
4 - 30 + Layers |
| Panel Size(max): |
21" x 24" |
| PCB Thickness: |
0.016" to 0.120" |
| Line & Spaces: |
0.003" / 0.003" Inner Layers;0.004" Outer Layers |
| Hole Size: |
0.008" Thru Hole (Finished Size) and Buried Via,
10:1 Aspect Ratio /0.004" HDI Microvia |
| Materials: |
FR4,High Tg Epoxy,BT,Nelco-13,Polyimide,N6000,RCC,Hybrids |
| Surface Finishes: |
ENi/IAu,OSP,Immersion Silver,Immersion Tin |
| Special Products: |
Blind/Buried Via,HDI Microvia,Rigid Flex |
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| Technologies |
| High Density Rigid and Rigid Fles |
| Integrated HDI |
| Sequential Blind Via Hole |
| Via Hole Plugging |
| CAF Resistant Materials |
| Lead-free and Halogen-free Materials |
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