|
Feature
|
Condltlon
|
Current
|
2007
|
|
Plating
Capability
|
Aspect
Ratio(Depth Diameter)
|
Mechanical
Through Hole
|
10:01
|
15:01
|
|
|
Laser
Blind via
|
|
|
|
Solder
Mask
|
Minimum
S/M Dam
|
Minimum
|
3mil
|
3mil
|
|
Minimum
S/M Opening
|
Minimum
|
2mil
|
1.5mil
|
|
Surface
Finish
|
Organic
Solderability Preservative(OSP)
|
|
Yes
|
Yes
|
|
Electroless
Nickel /Immersion Gold(ENIG)
|
|
Yes
|
Yes
|
|
Selective
OSP/ENIG
|
|
Yes
|
Yes
|
|
Hot
Air Solder Leverling (HASL)
|
|
Yes
|
Yes
|
|
Immersion
Silver
|
|
Yes
|
Yes
|
|
Immersion
Tin
|
|
Yes
|
Yes
|
|
Carbon
Ink
|
|
Yes
|
Yes
|
|
Electric
Test Capability
|
BGA
pith
|
Minimum
|
16mil
|
16mil
|
|
Connector
Pitch
|
Minimum
|
8mil
|
8mil
|
|
Pad
Size
|
|
8mil
|
8mil
|
|
Board
thickness
|
|
1
|
1.33
|
|
Cpk
|
Dimension
|
Etch
feature to Etch feature
|
1
|
1.33
|
|
Etch
feature to Hole
|
1
|
1.33
|
|
Hole
to Hole
|
1
|
1.33
|
|
Hole
to Edge
|
1
|
1.33
|
|
Edge
to Edge
|
1
|
1.33
|
|
Impedance
|
|
1
|
1.33
|
|
Embedded
Passive
|
Embedded
Capacitor
|
Polymer
Thick Film
|
No
|
Yes
|
|
Flexible
Thin
Film
|
Normal
DK
|
No
|
Yes
|
|
High
DK
|
No
|
Yes
|
|
|
Embedded
Resistor
|
Polymer
Thick
Film
|
With
Laser trim
|
No
|
No
|
|
w/o
Laser trim
|
No
|
Yes
|
|
Metal
Film
|
250ohm/Sq&under
|
No
|
Yes
|
|
500ohm/Sq&under
|
No
|
Yes
|
|
|
|
|
|
|
|
